Invention Grant
US09159673B2 Forming interconnect structures using pre-ink-printed sheets 有权
使用预先印墨的薄片形成互连结构

Forming interconnect structures using pre-ink-printed sheets
Abstract:
A method of forming a device includes printing conductive patterns on a dielectric sheet to form a pre-ink-printed sheet, and bonding the pre-ink-printed sheet onto a side of a substrate. The conductive feature includes a through-substrate via extending from a first major side of the substrate to a second major side of the substrate opposite the first major side. A conductive paste is then applied to electrically couple conductive patterns to a conductive feature in the substrate.
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