Invention Grant
- Patent Title: Forming interconnect structures using pre-ink-printed sheets
- Patent Title (中): 使用预先印墨的薄片形成互连结构
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Application No.: US14204722Application Date: 2014-03-11
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Publication No.: US09159673B2Publication Date: 2015-10-13
- Inventor: Jung Cheng Ko , Chi-Chun Hsieh , Shang-Yun Hou , Wen-Chih Chiou , Shin-Puu Jeng , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/768 ; H01L23/14 ; H01L23/48 ; H01L23/498 ; H01L23/532 ; H01L23/525 ; H01L23/00

Abstract:
A method of forming a device includes printing conductive patterns on a dielectric sheet to form a pre-ink-printed sheet, and bonding the pre-ink-printed sheet onto a side of a substrate. The conductive feature includes a through-substrate via extending from a first major side of the substrate to a second major side of the substrate opposite the first major side. A conductive paste is then applied to electrically couple conductive patterns to a conductive feature in the substrate.
Public/Granted literature
- US20140191395A1 Forming Interconnect Structures Using Pre-Ink-Printed Sheets Public/Granted day:2014-07-10
Information query
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