A semiconductor device which uses a semiconductor chip originally designed for flip chip bonding and is assembled by a wire bonding process to reduce the cost of assembling a semiconductor product. A second electrode pad group and a fourth electrode pad group are located in the central area of the semiconductor chip and a first electrode pad group and a third electrode pad group are located adjacently to the two long sides of the semiconductor chip. The electrode pads of each electrode group are electrically coupled with a plurality of conductive wires. The layouts of the wiring layers formed in an interconnection substrate are modified so that the wire-bonded semiconductor device is the same as a flip-chip-bonded semiconductor device in terms of the positions of input/output signals.