Invention Grant
- Patent Title: Solid-state image pickup device, and camera module
- Patent Title (中): 固态图像拾取装置和相机模块
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Application No.: US14093632Application Date: 2013-12-02
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Publication No.: US09159752B2Publication Date: 2015-10-13
- Inventor: Motohiro Maeda , Nagataka Tanaka
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-135122 20130627
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L27/146 ; H04N5/335
Abstract:
According to one embodiment, a solid-state image pickup device includes a pixel array that includes a two-dimensionally arranged matrix of photoelectric conversion elements corresponding to pixels of a picked-up image. Each of the photoelectric conversion elements includes a first conductive semiconductor region and a second conductive semiconductor region between which an uneven junction plane is formed.
Public/Granted literature
- US20150002712A1 SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF FABRICATING THE SAME, AND CAMERA MODULE Public/Granted day:2015-01-01
Information query
IPC分类:
