Invention Grant
US09159777B2 Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil
有权
包含电感线圈的管芯装置和制造包含电感器线圈的管芯装置的方法
- Patent Title: Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil
- Patent Title (中): 包含电感线圈的管芯装置和制造包含电感器线圈的管芯装置的方法
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Application No.: US13087458Application Date: 2011-04-15
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Publication No.: US09159777B2Publication Date: 2015-10-13
- Inventor: Georg Meyer-Berg
- Applicant: Georg Meyer-Berg
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L49/02 ; H01L23/522 ; H01L23/64 ; H01L23/00
Abstract:
In various embodiments, a die arrangement may be provided. The die arrangement may include a die, at least one bond pad, at least one redistribution trace electrically connecting the die with the at least one bond, and at least one inductor enclosing the at least one bond pad and the at least one redistribution trace.
Public/Granted literature
- US20120261796A1 DIE ARRANGEMENTS AND METHODS OF MANUFACTURING A DIE ARRANGEMENT Public/Granted day:2012-10-18
Information query
IPC分类:
