Invention Grant
- Patent Title: High speed high density connector assembly
- Patent Title (中): 高速高密度连接器总成
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Application No.: US14592855Application Date: 2015-01-08
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Publication No.: US09160114B2Publication Date: 2015-10-13
- Inventor: Feng Pan
- Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agent Ming Chieh Chang; Wei Te Chung
- Priority: CN201210040622 20120222
- Main IPC: H01R13/6587
- IPC: H01R13/6587 ; H01R12/71 ; H01R13/6474

Abstract:
An electrical connector assembly (1; 2; 3) includes a first connector (10; 50; 70; 90) and a second connector (20; 60; 80; 91). The first connector includes a first conductive body (11, 12; 32; 502; 71; 920) including a first mounting face, a plurality of first contacts (121; 321; 551; 921), a plurality of first shielding members (123; 323; 53; 720; 900), and a plurality first insulator (122; 322; 550). The second connector (20; 60; 80; 91) includes a second conductive body (21; 61; 822) for being mated with the first conductive body and including a second mounting face, a plurality of second contacts (220; 420; 620) and mated with the first contacts, a plurality of second shielding members (222; 422; 68), and a plurality second insulator (221; 421; 621). A total transmitting traces of the first contacts and the second contacts between the first mating face and the second mating face are circumferentially fully shielded.
Public/Granted literature
- US20150118908A1 HIGH SPEED HIGH DENSITY CONNECTOR ASSEMBLY Public/Granted day:2015-04-30
Information query
IPC分类: