Invention Grant
- Patent Title: Wire grip
- Patent Title (中): 线夹
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Application No.: US13973650Application Date: 2013-08-22
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Publication No.: US09160149B2Publication Date: 2015-10-13
- Inventor: Tamotsu Iwama
- Applicant: Nagaki Seiki Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: NAGAKI SEIKI CO., LTD.
- Current Assignee: NAGAKI SEIKI CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wilson Sonsini Goodrich & Rosati
- Main IPC: H02G1/04
- IPC: H02G1/04 ; H02G1/00 ; B25B25/00 ; F16B2/18

Abstract:
Provided is a wire grip, which has excellent workability for bracing the wire and which can grip a linear object for bracing the wire without applying any excessive load to the linear object.The wire grip comprises a stationary-side wire gripping portion having a body and a movable-side wire gripping portion, whereby a linear object can be gripped between them, where a first action portion for moving the movable-side wire gripping portion back and forth and a second action portion connected to the first action portion by a connecting rod are turnably attached to the body, whereby the connecting rod is pulled substantially parallel to the gripping portions so that the connecting rod, and the first and second action portions are linked to act to move the movable-side wire gripping portion towards the stationary-side wire gripping portion.
Public/Granted literature
- US20140054524A1 WIRE GRIP Public/Granted day:2014-02-27
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