Invention Grant
- Patent Title: Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate
- Patent Title (中): 感光性导电膜，导电膜的形成方法，导电图案的形成方法以及导电膜基板
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Application No.: US14153887Application Date: 2014-01-13
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Publication No.: US09161442B2Publication Date: 2015-10-13
- Inventor: Hiroshi Yamazaki
- Applicant: Hitachi Chemical Company, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Fitch Even Tabin & Flannery
- Priority: JP2008-214113 20080822
- Main IPC: H05K1/03
- IPC: H05K1/03 ; G02F1/1343 ; H05K1/09
Abstract:
A photosensitive conductive film 10 according to the invention includes a support film 1, a conductive layer 2 containing conductive fiber formed on the support film 1, and a photosensitive resin layer 3 formed on the conductive layer 2.
Public/Granted literature
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