A printed wiring board includes a resin layer, pads formed on the resin layer and positioned to be connected to an electronic component, and a solder-resist layer formed on the resin layer and exposing upper surfaces of the pads and portions of side walls of the pads. Each of the pads has a metal layer such that the metal layer is formed on each of the upper surfaces of the pads and each of the portions of the side walls of the pads exposed by the solder-resist layer.