Invention Grant
- Patent Title: Light emitting device and manufacturing method thereof
- Patent Title (中): 发光元件及其制造方法
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Application No.: US14135625Application Date: 2013-12-20
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Publication No.: US09161458B2Publication Date: 2015-10-13
- Inventor: Tadaaki Miyata
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2012-280351 20121222
- Main IPC: F21V1/00
- IPC: F21V1/00 ; H05K3/32 ; H05K1/18 ; H05K3/22 ; H01L25/075 ; H01L33/62 ; H05K1/14
Abstract:
A light-emitting device includes a first substrate having a through-hole, a plurality of first light-emitting elements that are arranged on the first substrate, a second substrate that is attached to the first substrate to cover the through-hole of the first substrate, and a second light-emitting element arranged on the second substrate, and electrically connected to wiring of the first substrate.
Public/Granted literature
- US20140177220A1 LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-06-26
Information query
