Invention Grant
- Patent Title: Methods for cleaving a bonded wafer structure
- Patent Title (中): 切割接合晶片结构的方法
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Application No.: US13663038Application Date: 2012-10-29
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Publication No.: US09165802B2Publication Date: 2015-10-20
- Inventor: Gregory A. Young , Jeffrey L. Libbert
- Applicant: SunEdison Semiconductor Limited (UEN201334164H)
- Applicant Address: SG Singapore
- Assignee: SunEdison Semiconductor Limited (UEN201334164H)
- Current Assignee: SunEdison Semiconductor Limited (UEN201334164H)
- Current Assignee Address: SG Singapore
- Agency: Armstrong Teasdale LLP
- Main IPC: B32B38/10
- IPC: B32B38/10 ; H01L21/67 ; B32B43/00
Abstract:
Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.
Public/Granted literature
- US20130105538A1 METHODS FOR CLEAVING A BONDED WAFER STRUCTURE Public/Granted day:2013-05-02
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