An apparatus or method for forming a tape-based, epitaxial lift-off film. The epitaxial lift-off film can be for at least one of a solar device, a semiconductor device, and an electronic device. The apparatus can comprise: a tape supply section, the tape supply section providing an unloaded support tape; a lamination section for receiving the unloaded support tape and a plurality of substrates, each substrate containing an epitaxial film thereon, the lamination section adhering the substrates to the unloaded support tape to form a loaded support tape; and an ELO etch section comprising a pressure system for applying pressure on said loaded support tape such that pressure is applied progressively downward and progressively towards a center-line of said loaded support tape when passing through said ELO etch section, the ELO etch section removing the substrates from the loaded support tape, while leaving the epitaxial film on the loaded support tape.