Invention Grant
- Patent Title: Conveyance device and substrate processing system
- Patent Title (中): 输送装置和基板处理系统
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Application No.: US14361869Application Date: 2012-11-28
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Publication No.: US09165810B2Publication Date: 2015-10-20
- Inventor: Tsutomu Hiroki , Ikuo Sawada , Kazuyoshi Matsuzaki , Yoshiki Fukuhara
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2011-264099 20111201
- International Application: PCT/JP2012/080766 WO 20121128
- International Announcement: WO2013/081013 WO 20130606
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67

Abstract:
A conveyance device, which conveys wafers in a casing 30, includes a primary blowing fan 17 that generates airflow within the casing 30 in a first direction; a discharge opening 26 that is located at a downstream side of the airflow generated by the primary blowing fan 17, is interconnected with the interior of the casing 30, and discharges gases at the interior of the casing 30 outside of the casing 30; a base 18d that is supported by a gate-shaped conveyance arm 22 disposed within the casing 30 and moves within the casing 30 at the upstream side of the discharge opening 26 and at the downstream side of the primary blowing fan 17; an end effector 21 that is located at the base 18d and that carries wafers; and a blowing fan 19 that is located at the base and that generates airflow in the first direction.
Public/Granted literature
- US20150125238A1 CONVEYANCE DEVICE AND SUBSTRATE PROCESSING SYSTEM Public/Granted day:2015-05-07
Information query
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