Invention Grant
- Patent Title: Method for singulating a component composite assembly
- Patent Title (中): 单组分复合组件的方法
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Application No.: US14002754Application Date: 2012-03-16
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Publication No.: US09165816B2Publication Date: 2015-10-20
- Inventor: Heribert Zull , Korbinian Perzlmaier , Andreas Ploessl , Thomas Veit , Mathias Kaempf , Jens Dennemarck , Bernd Boehm
- Applicant: Heribert Zull , Korbinian Perzlmaier , Andreas Ploessl , Thomas Veit , Mathias Kaempf , Jens Dennemarck , Bernd Boehm
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Occhiuti & Rohlicek LLP
- Priority: DE102011015725 20110331
- International Application: PCT/EP2012/054714 WO 20120316
- International Announcement: WO2012/130643 WO 20121004
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/78 ; H01L21/784 ; H01L21/782 ; H01L31/18 ; H01L33/00 ; H01S5/02
Abstract:
A method relates to separating a component composite into a plurality of component regions, wherein the component composite is provided having a semiconductor layer sequence comprising a region for generating or for receiving electromagnetic radiation. The component composite is mounted on a rigid subcarrier. The component composite is separated into the plurality of component regions, wherein one semiconductor body is produced from the semiconductor layer sequence for each component region. The component regions are removed from the subcarrier.
Public/Granted literature
- US20140080287A1 METHOD FOR SINGULATING A COMPONENT COMPOSITE ASSEMBLY Public/Granted day:2014-03-20
Information query
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