Invention Grant
US09165852B2 Mounting structure for printed circuit board, and semiconductor device using such structure
有权
印刷电路板的安装结构，以及使用这种结构的半导体器件
- Patent Title: Mounting structure for printed circuit board, and semiconductor device using such structure
- Patent Title (中): 印刷电路板的安装结构，以及使用这种结构的半导体器件
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Application No.: US14349023Application Date: 2012-09-18
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Publication No.: US09165852B2Publication Date: 2015-10-20
- Inventor: Noriho Terasawa , Yasuyuki Momose
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-shi
- Agent Manabu Kanesaka
- Priority: JP2011-222405 20111007
- International Application: PCT/JP2012/073793 WO 20120918
- International Announcement: WO2013/051387 WO 20130411
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/34 ; H05K1/02 ; H05K3/36 ; H05K7/14 ; H05K7/02 ; H01L23/049 ; H01L23/00 ; H01L25/07 ; H01L23/36 ; H01L23/373
Abstract:
A mounting structure for a printed circuit board, includes a printed circuit board to which a heavy material is fixed; a fixing member fixed to the printed circuit board immediately below the heavy material; and a receiving member fixed to a main body. A bottom portion of the fixing member is disposed in the receiving member, and fixed to the receiving member by a resin adhesive.
Public/Granted literature
- US20140233188A1 MOUNTING STRUCTURE FOR PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE USING SUCH STRUCTURE Public/Granted day:2014-08-21
Information query
IPC分类:
