Invention Grant
US09165872B2 Chip scale diode package no containing outer lead pins and process for producing the same
有权
芯片尺寸二极管封装不含外引脚引脚及其制造方法
- Patent Title: Chip scale diode package no containing outer lead pins and process for producing the same
- Patent Title (中): 芯片尺寸二极管封装不含外引脚引脚及其制造方法
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Application No.: US14523066Application Date: 2014-10-24
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Publication No.: US09165872B2Publication Date: 2015-10-20
- Inventor: Ching-Hohn Lien , Xing-Xiang Huang , Hsing-Tsai Huang , Hong-Zong Xu
- Applicant: SFI Electronics Technology Inc.
- Applicant Address: TW Taoyuan County
- Assignee: SFI ELECTRONICS TECHNOLOGY INC.
- Current Assignee: SFI ELECTRONICS TECHNOLOGY INC.
- Current Assignee Address: TW Taoyuan County
- Agency: Bacon & Thomas, PLLC
- Priority: TW102140150A 20131105
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L23/52 ; H01L23/28 ; H01L21/44 ; H01L21/48 ; H01L23/00 ; H01L25/07 ; H01L25/00 ; H01L23/31
Abstract:
A novel chip scale diode package due to no containing outer lead pins is miniaturized like a chip scale appearance to promote dimensional accuracy so that the diode package is so suitably produced by automation equipment to get automated mass production; the produced diode package may contain one or more diode chips to increase versatile functions more useful in applications, such as produced as a SMT diode package or an array-type SMT diode, and the present diode package due to made of no lead-containing material conforms to requirements for environmental protection.
Public/Granted literature
- US20150123254A1 CHIP SCALE DIODE PACKAGE NO CONTANING OUTER LEAD PINS AND PROCESS FOR PORDUCING THE SAME Public/Granted day:2015-05-07
Information query
IPC分类:
