Invention Grant
- Patent Title: Package-on-package structure and methods for forming the same
- Patent Title (中): 封装封装结构及其形成方法
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Application No.: US13874821Application Date: 2013-05-01
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Publication No.: US09165876B2Publication Date: 2015-10-20
- Inventor: Chien-Hsun Lee , Jung Wei Cheng , Hao-Cheng Hou , Tsung-Ding Wang , Jiun Yi Wu , Ming-Chung Sung
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/498 ; H01L21/56 ; H01L25/10 ; H01L25/00 ; H01L21/48 ; H01L23/00 ; H01L23/31
Abstract:
A method includes coining solder balls of a bottom package, wherein top surfaces of the solder balls are flattened after the step of coining. The solder balls are molded in a molding material. The top surfaces of the solder balls are through trenches in the molding material.
Public/Granted literature
- US20140252609A1 Package-on-Package Structure and Methods for Forming the Same Public/Granted day:2014-09-11
Information query
IPC分类:
