Invention Grant
- Patent Title: Method and a system for producing a semi-conductor module
- Patent Title (中): 用于制造半导体模块的方法和系统
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Application No.: US13580455Application Date: 2011-02-22
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Publication No.: US09165907B2Publication Date: 2015-10-20
- Inventor: Andreas Jakob , Thomas Kaiser
- Applicant: Andreas Jakob , Thomas Kaiser
- Applicant Address: DE Munich
- Assignee: Interposers GMBH
- Current Assignee: Interposers GMBH
- Current Assignee Address: DE Munich
- Agency: Lathrop & Gage LLP
- Priority: DE102010008789 20100222; DE102010045372 20100914
- International Application: PCT/EP2011/000828 WO 20110222
- International Announcement: WO2011/101170 WO 20110825
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/065 ; H01L25/00 ; H01L21/48 ; H01L23/538
Abstract:
In a method for producing a semi-conductor module (10) comprising at least two semi-conductor chips (12, 14) and an interposer (20) which has electrically conductive structures (28) connecting the semi-conductor chips (12, 14) to one another, the interposer (20) is printed directly onto a first (12) of the semi-conductor chips. When the interposer (20) is printed on, the electrically conductive structures (28) are produced by means of electrically conductive ink (68). The second semi-conductor chip (14) is mounted on the interposer (20) such that the two semi-conductor chips (12, 14) are arranged one above the other and that the interposer (20) forms an intermediate layer between the two semi-conductor chips (12, 14).
Public/Granted literature
- US20130059402A1 Method and A System for Producing a Semi-Conductor Module Public/Granted day:2013-03-07
Information query
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