Invention Grant
US09165969B2 Apparatus having thinner interconnect line for photodetector array and thicker interconnect line for periphery region
有权
具有较薄的用于光电检测器阵列的互连线和用于周边区域的较厚互连线的装置
- Patent Title: Apparatus having thinner interconnect line for photodetector array and thicker interconnect line for periphery region
- Patent Title (中): 具有较薄的用于光电检测器阵列的互连线和用于周边区域的较厚互连线的装置
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Application No.: US12727115Application Date: 2010-03-18
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Publication No.: US09165969B2Publication Date: 2015-10-20
- Inventor: Duli Mao , Vincent Venezia , Howard Rhodes , Hsin Chih Tai , Yin Qian
- Applicant: Duli Mao , Vincent Venezia , Howard Rhodes , Hsin Chih Tai , Yin Qian
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
An apparatus of one aspect includes a photodetector array, and a peripheral region at a periphery of the photodetector array. A thinner interconnect line corresponding to the photodetector array is disposed within one or more insulating layers. A thicker interconnect line corresponding to the peripheral region is disposed within the one or more insulating layers. Other apparatus, methods, and systems are also disclosed.
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