Invention Grant
- Patent Title: Image sensor module and method of manufacturing the same
- Patent Title (中): 图像传感器模块及其制造方法
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Application No.: US13713503Application Date: 2012-12-13
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Publication No.: US09166095B2Publication Date: 2015-10-20
- Inventor: Seung Taek Yang , Jong Hoon Kim
- Applicant: SK HYNIX INC.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2008-0089466 20080910
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/18 ; H01L27/146
Abstract:
An image sensor module includes a transparent substrate having recesses defined in a lower face thereof. A light concentration member includes transparent light concentration parts each of which are disposed in a corresponding one of the recesses. Color filters are disposed over each of the light concentration parts and photo diode units having photo diodes are disposed over each of the color filters. An insulation member covers the photo diode units and input/output terminals disposed over the insulation member are each electrically connected to a corresponding photo diode unit.
Public/Granted literature
- US20130102106A1 IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-04-25
Information query
IPC分类:
