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Invention Grant
US09166132B2 Light-emitting element mounting package having heat radiation route, manufacturing method of the same, and light-emitting element package 有权
具有散热路径的发光元件安装封装，其制造方法和发光元件封装

Light-emitting element mounting package having heat radiation route, manufacturing method of the same, and light-emitting element package
Abstract:
A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate.
Abstract(Chinese):

一种发光元件安装封装，包括：形成第一发光元件安装部的第一布线，其设置在基板的一个表面上以安装发光元件;以及第一布线，其一端和另一端， 所述一端电连接到所述第一发光元件安装部，从而可热转印，另一端从所述基板的另一表面突出。

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