LED substrate of the present invention includes: translucent substrate body-in which an LED chip is disposed on a front face; and heat dissipation path provided in substrate body to dissipate heat generated in the LED chip. Substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face. Heat dissipation path includes: heat transfer path section provided in the through hole; and heat dissipation pattern section provided on the back face of substrate body, and connected to heat transfer path section. Thus, LED substrate having superior heat dissipation is realized.