Invention Grant
- Patent Title: Integrated circuit wireless communication unit and method for providing a power supply
- Patent Title (中): 集成电路无线通信单元和提供电源的方法
-
Application No.: US14316759Application Date: 2014-06-26
-
Publication No.: US09166538B2Publication Date: 2015-10-20
- Inventor: Hao-Ping Hong , Patrick Stanley Riehl
- Applicant: MediaTek Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: MediaTek Singapore Pte. Ltd.
- Current Assignee: MediaTek Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agent Winston Hsu; Scott Margo
- Main IPC: H03G3/20
- IPC: H03G3/20 ; H03F3/04 ; H03F3/195 ; H03F1/02 ; H03F3/191

Abstract:
An integrated circuit is described for providing a power supply to a radio frequency (RF) power amplifier (PA). The integrated circuit comprises a low-frequency power supply path comprising a switching regulator and a high-frequency power supply path arranged to regulate an output voltage of a combined power supply at an output port of the integrated circuit for coupling to a load. The combined power supply is provided by the low-frequency power supply path and high-frequency power supply path. The high-frequency power supply path comprises: an amplifier comprising a voltage feedback and arranged to drive a power supply signal on the high-frequency power supply path; and a high-frequency-path supply module arranged to provide a high frequency supply to drive the amplifier, where the high-frequency-path supply module comprises a pulse-width modulator operably coupled to the high frequency supply via a filter and arranged to provide a filtered pulse-width modulated signal to the high frequency supply.
Public/Granted literature
- US20140306763A1 INTEGRATED CIRCUIT WIRELESS COMMUNICATION UNIT AND METHOD FOR PROVIDING A POWER SUPPLY Public/Granted day:2014-10-16
Information query