Invention Grant
US09167684B2 Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels
有权
使用流体储存器和连接的流体通道形成印刷电路板的装置和方法
- Patent Title: Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels
- Patent Title (中): 使用流体储存器和连接的流体通道形成印刷电路板的装置和方法
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Application No.: US13902149Application Date: 2013-05-24
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Publication No.: US09167684B2Publication Date: 2015-10-20
- Inventor: Mark Lee Allen , Chris Bower , Darryl Cotton
- Applicant: Nokia Corporation
- Applicant Address: FI Espoo
- Assignee: Nokia Technologies Oy
- Current Assignee: Nokia Technologies Oy
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/11 ; H05K1/02 ; H05K1/09 ; H01L23/00 ; H05K3/10

Abstract:
A substrate including a fluid reservoir and a connected fluid channel, the fluid reservoir positioned away from a component region of the substrate, the fluid channel configured to extend from the fluid reservoir to guide an electrically conductive fluid from the fluid reservoir at a reservoir end of the fluid channel through the fluid channel to a component end of the fluid channel, the component end extending to the component region of the substrate to enable the formation of an electrical connection to a connector of an electronic component appropriately positioned in the component region, formation of the electrical connection allowing the electronic component to be interconnected to other electronic components using one or more of the fluid reservoir and fluid channel.
Public/Granted literature
- US20140345924A1 Apparatus and Associated Methods Public/Granted day:2014-11-27
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