Invention Grant
- Patent Title: Electronic device module
- Patent Title (中): 电子设备模块
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Application No.: US13459768Application Date: 2012-04-30
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Publication No.: US09167695B2Publication Date: 2015-10-20
- Inventor: Takuya Asano , Masaki Kondoh
- Applicant: Takuya Asano , Masaki Kondoh
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2011-110722 20110517
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K1/02
Abstract:
An electronic device module includes a first substrate having a first wiring layer and a first alignment mark, the first alignment mark being transparent in a visible region of the electromagnetic spectrum, and a second substrate facing a part of the first substrate and having a second wiring layer and a second alignment mark facing the first alignment mark.
Public/Granted literature
- US20120293974A1 ELECTRONIC DEVICE MODULE Public/Granted day:2012-11-22
Information query
