Aspects of the invention are directed to a power module including a metal base, an insulating substrate which is attached to the metal base, a semiconductor chip and a control terminal which are attached to a circuit pattern of the insulating substrate, and a resin case which is attached to the metal base. The control terminal can include a penetration portion which penetrates a cover of the resin case, an L-shaped processed portion which is connected to the penetration portion, and a connection portion which is connected to the L-shaped processed portion. A protrusion portion can be installed in a portion of the control terminal, which penetrates the cover. The protrusion portion can be in contact with a protrusion receiving portion which is configured with a front surface of the cover. The L-shaped processed portion can be in contact with a convex portion in a rear surface of the cover.