Invention Grant
- Patent Title: Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
- Patent Title (中): 用于高温环境的印刷电路板组件的无铅焊料合金
-
Application No.: US12517652Application Date: 2006-12-13
-
Publication No.: US09167704B2Publication Date: 2015-10-20
- Inventor: Andy A. Hrametz , Alex T. Duncan
- Applicant: Andy A. Hrametz , Alex T. Duncan
- Applicant Address: US TX Houston
- Assignee: Halliburton Energy Services, Inc.
- Current Assignee: Halliburton Energy Services, Inc.
- Current Assignee Address: US TX Houston
- Agency: Schwegman Lundberg & Woessner, P.A.
- Agent Benjamin Fite
- International Application: PCT/US2006/047586 WO 20061213
- International Announcement: WO2008/073090 WO 20080619
- Main IPC: H05K3/34
- IPC: H05K3/34 ; B23K35/26 ; C22C13/00
Abstract:
A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
Public/Granted literature
- US20110052444A1 LEAD-FREE SOLDER ALLOY FOR PRINTED CIRCUIT BOARD ASSEMBLIES FOR HIGH-TEMPERATURE ENVIRONMENTS Public/Granted day:2011-03-03
Information query
