Invention Grant
- Patent Title: Patterned metal layer to control solder connection between laser and submount in a magnetic head
- Patent Title (中): 图案化金属层,用于控制激光与磁头之间的焊接连接
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Application No.: US14663031Application Date: 2015-03-19
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Publication No.: US09171562B1Publication Date: 2015-10-27
- Inventor: Wachira Puttichaem , Bin Ouyang
- Applicant: Western Digital (Fremont), LLC
- Applicant Address: US CA Fremont
- Assignee: Western Digital (Fremont), LLC
- Current Assignee: Western Digital (Fremont), LLC
- Current Assignee Address: US CA Fremont
- Main IPC: G11B11/00
- IPC: G11B11/00 ; G11B13/08 ; G11B5/48 ; G11B5/60 ; G11B7/12 ; G11B5/00

Abstract:
A laser diode device is affixed to a mounting face of a slider, opposite the air bearing surface. The laser includes a submount having an electrically conductive surface layer that is normal to the mounting face. The electrically conductive surface layer is a patterned metal layer that includes a lateral probing region and a laser mounting region to which a laser is soldered. The laser mounting region is connected to the lateral probing region by a bridge portion of the patterned metal layer. The laser mounting region is otherwise separated from the lateral probing region by a solder blocking gap in which the submount lacks the patterned metal layer, and which is adjacent to the laser. The solder blocking gap defines a solder blocking gap height normal to the mounting face that is in the range of ⅔rds to ⅚ths of a total height of the laser mounting region.
Information query
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