Invention Grant
- Patent Title: Low noise semiconductor devices
- Patent Title (中): 低噪声半导体器件
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Application No.: US12614362Application Date: 2009-11-06
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Publication No.: US09171726B2Publication Date: 2015-10-27
- Inventor: Giovanni Calabrese , Domagoj Siprak , Wolfgang Molzer , Uwe Hodel
- Applicant: Giovanni Calabrese , Domagoj Siprak , Wolfgang Molzer , Uwe Hodel
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Lee & Hayes, PLLC
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/265 ; H01L29/06 ; H01L29/08 ; H01L29/66 ; H01L29/78 ; H01L21/223

Abstract:
Semiconductor devices may be configured to reduce noise in the devices. For example, a semiconductor device may be configured or made with a first doped region within a semiconductor substrate to operate as an extended drain region, a trench isolation region, a second doped region between the first doped region and the trench isolation region, wherein the trench isolation region and the second doped region may be at least partially formed within the first doped region. Additionally, or alternatively, the second doped region may be within the first doped region and at least partially surround the trench isolation region, the first and second doped regions may have the same conductivity type, and the second doped region may have a higher conductivity than the first doped region.
Public/Granted literature
- US20110108916A1 Semiconductor Devices and Methods Public/Granted day:2011-05-12
Information query
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