Disclosed is a packaged device, comprising a carrier comprising a first carrier contact, a first electrical component having a first top surface and a first bottom surface, the first electrical component comprising a first component contact disposed on the first top surface, the first bottom surface being connected to the carrier, an embedded system comprising a second electrical component having a second top surface, an interconnect element, and a first connecting element, the embedded system having a system bottom surface, wherein the system bottom surface comprises a first system contact, wherein the second top surface comprises a first component contact, and wherein the first system contact is connected to the first component contact by the interconnect element and the first component contact of the second electrical component is connected to the first carrier contact by means of the first connecting element.