Method of making a semiconductor chip including identifying marks

Invention Grant

US09171806B2 Method of making a semiconductor chip including identifying marks 有权

Title translation: 制造包括识别标记的半导体芯片的方法

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Patent Title: Method of making a semiconductor chip including identifying marks
Patent Title (中): 制造包括识别标记的半导体芯片的方法
Application No.: US14299481

Application Date: 2014-06-09
Publication No.: US09171806B2

Publication Date: 2015-10-27
Inventor: Joerg Ortner
Applicant: Infineon Technologies AG
Applicant Address: DE Neubiberg
Assignee: Infineon Technologies AG
Current Assignee: Infineon Technologies AG
Current Assignee Address: DE Neubiberg
Agency: Dicke, Billig & Czaja, PLLC
Main IPC: H01L21/76
IPC: H01L21/76 ; H01L23/544 ; H01L21/26

Method of making a semiconductor chip including identifying marks

Abstract:

A semiconductor chip includes a first mark for identifying a position of the chip within an exposure field. The semiconductor chip includes a first matrix in a first layer of the chip and a second mark within the first matrix identifying a position of the exposure field on a wafer.

Abstract(Chinese):

半导体芯片包括用于识别曝光区域内的芯片的位置的第一标记。半导体芯片包括芯片的第一层中的第一矩阵和第一矩阵内的第二标记，以识别晶片上的曝光场的位置。

Public/Granted literature

US20140287566A1 METHOD OF MAKING A SEMICONDUCTOR CHIP INCLUDING IDENTIFYING MARKS Public/Granted day:2014-09-25

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Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/71	..限定在组H01L21／70中的器件的特殊部件的制造（H01L21/28，H01L21/44，H01L21/48优先）
H01L21/76	...组件间隔离区的制作