Invention Grant
- Patent Title: Circuit module with multiple submodules
- Patent Title (中): 具有多个子模块的电路模块
-
Application No.: US13341890Application Date: 2011-12-30
-
Publication No.: US09171823B2Publication Date: 2015-10-27
- Inventor: KahWee Gan , Yaohuang Huang
- Applicant: KahWee Gan , Yaohuang Huang
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group PLLC
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/12 ; H01L23/053 ; H05K1/00 ; H05K1/11 ; H01R43/00 ; H05K3/30 ; H01L25/03 ; H01L23/00 ; H01L23/538 ; H01L25/065 ; H01L25/00 ; H01L21/56
Abstract:
An embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has a first submodule node, and the second submodule is disposed over the first submodule and has a second submodule node. The conductive structure couples the first submodule node to one of the module nodes and couples the second submodule node to one of the module nodes. Another embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has first submodule nodes, and the second submodule is disposed over the first submodule and has second submodule nodes. The conductive structure couples one of the first and second submodule nodes to one of the module nodes and couples one of the first submodule nodes to one of the second submodule nodes.
Public/Granted literature
- US20130170169A1 CIRCUIT MODULE WITH MULTIPLE SUBMODULES Public/Granted day:2013-07-04
Information query
