Invention Grant
- Patent Title: Heat dissipation structure
- Patent Title (中): 散热结构
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Application No.: US13543984Application Date: 2012-07-09
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Publication No.: US09171983B2Publication Date: 2015-10-27
- Inventor: Huang-Chi Tseng , Chiuan-Ting Li , Wei-Jieh Lee , Chun-Ming Yang , Kuan-Wen Tung
- Applicant: Huang-Chi Tseng , Chiuan-Ting Li , Wei-Jieh Lee , Chun-Ming Yang , Kuan-Wen Tung
- Applicant Address: TW Hsin-Chu
- Assignee: AU OPTRONICS CORPORATION
- Current Assignee: AU OPTRONICS CORPORATION
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Agent Justin King
- Priority: CN201210066800 20120313
- Main IPC: H01L31/042
- IPC: H01L31/042 ; H01L31/052 ; H02S40/42 ; F28F3/02
Abstract:
A heat dissipation structure is provided and includes a plurality of heat conduction bases and at least one flexible fin. Each of the heat conduction bases includes a first surface and a second surface. A positioning groove is formed in the first surface of each of the heat conduction bases, and the second surface of each of the heat conduction bases is assembled to a backlight surface of a solar module. The fin is coupled to the positioning grooves and connected between the heat conduction bases.
Public/Granted literature
- US20130240016A1 HEAT DISSIPATION STRUCTURE Public/Granted day:2013-09-19
Information query
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