Invention Grant
- Patent Title: Light-emitting device, lighting device, light-emitting device assembly, and method for producing light-emitting device
- Patent Title (中): 发光装置，照明装置，发光装置组件以及发光装置的制造方法
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Application No.: US13778515Application Date: 2013-02-27
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Publication No.: US09172010B2Publication Date: 2015-10-27
- Inventor: Shinsuke Wakiya , Toshikazu Takagi , Hirofumi Fukutsuka , Yasunari Ooyabu , Hiroyuki Katayama , Takashi Kondo , Hiroki Kono
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-046876 20120302
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L25/075 ; H01L33/60
Abstract:
A light-emitting device includes a substrate including a mirror surface region on its upper surface, a semiconductor light-emitting element disposed in the mirror surface region, and an encapsulating layer joined onto the upper surface of the substrate. The encapsulating layer includes a lower layer that is in contact with the upper surface of the substrate, covers the surrounding of the semiconductor light-emitting element, and contains phosphor; and an upper layer that is positioned on the lower layer, and has a larger phosphor content per unit area than that of the lower layer.
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Information query
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