Invention Grant
- Patent Title: Ultrasound probe and method of manufacturing ultrasound probe
- Patent Title (中): 超声探头及超声波探头的制造方法
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Application No.: US13795103Application Date: 2013-03-12
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Publication No.: US09172024B2Publication Date: 2015-10-27
- Inventor: Kengo Okada , Hiroyuki Shikata , Minoru Aoki , Satoru Tezuka , Yasuhisa Makita
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Medical Systems Corporation
- Applicant Address: JP Tokyo JP Otawara-shi
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Medical Systems Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Medical Systems Corporation
- Current Assignee Address: JP Tokyo JP Otawara-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-055236 20120313
- Main IPC: H01L41/25
- IPC: H01L41/25 ; H01L41/08 ; B06B1/06

Abstract:
A backing material is provided on the back face side of a piezoelectric transducer, with a first width substantially equal to the piezoelectric transducer widthwise and perpendicular to the radiation direction. A front face of a layer located on the front face side with regard to a wiring pattern has a width substantially equal to the first width. Moreover, the back face of this layer has a second width shorter than the first width. A space is provided between this layer and the backing material due to the difference between the first width and the second width of this layer, and a covering member covering the wiring pattern covers the wiring pattern extending at least from the folded section of the flexible substrate into the space.
Public/Granted literature
- US20130241355A1 ULTRASOUND PROBE AND METHOD OF MANUFACTURING ULTRASOUND PROBE Public/Granted day:2013-09-19
Information query
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