Invention Grant
US09172024B2 Ultrasound probe and method of manufacturing ultrasound probe 有权
超声探头及超声波探头的制造方法

Ultrasound probe and method of manufacturing ultrasound probe
Abstract:
A backing material is provided on the back face side of a piezoelectric transducer, with a first width substantially equal to the piezoelectric transducer widthwise and perpendicular to the radiation direction. A front face of a layer located on the front face side with regard to a wiring pattern has a width substantially equal to the first width. Moreover, the back face of this layer has a second width shorter than the first width. A space is provided between this layer and the backing material due to the difference between the first width and the second width of this layer, and a covering member covering the wiring pattern covers the wiring pattern extending at least from the folded section of the flexible substrate into the space.
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