Invention Grant
- Patent Title: High speed modular jack having central shield
- Patent Title (中): 具有中央屏蔽的高速模块插座
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Application No.: US14467070Application Date: 2014-08-25
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Publication No.: US09172189B2Publication Date: 2015-10-27
- Inventor: Sheng-Pin Gao , Chih-Ching Hsu , Dao-Kuan Zhang
- Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: CN2013205160188U 20130823
- Main IPC: H01R13/66
- IPC: H01R13/66 ; H01R13/6587 ; H01R24/64 ; H01R107/00 ; H01R12/72

Abstract:
A modular jack includes an insulative housing, a set of central shields, and a set of insert modules. The modular jack defines a mounting port. Each insert module includes a printed circuit broad assembly (PCBA) disposed horizontally in the mounting port and a terminal module located below the PCBA. The terminal module has a set of first terminals, a set of second terminals, and an insulative carrier holding the first and second terminals. Each central shield is disposed between two adjacent insert modules and mounted to the insulative housing. The central shield has a metal wafer and an insulative body for holding the metal wafer. The insulative body includes a pressing face extending along a front-to-back direction and the insulative carrier has a receiving pressure face extending along the front-to-back direction. Each terminal has a mounting portion for electrically and mechanically engaged with an exterior PCB.
Public/Granted literature
- US20150056826A1 HIGH SPEED MODULAR JACK HAVING CENTRAL SHIELD Public/Granted day:2015-02-26
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