Invention Grant
- Patent Title: Implantable medical device headers that facilitate device and lead configuration variants
- Patent Title (中): 可植入的医疗设备头,便于设备和引线配置变体
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Application No.: US14016395Application Date: 2013-09-03
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Publication No.: US09172192B2Publication Date: 2015-10-27
- Inventor: Dale F. Seeley , Michael T. Hegland
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: MEDTRONIC, INC.
- Current Assignee: MEDTRONIC, INC.
- Current Assignee Address: US MN Minneapolis
- Agency: Withers & Keys, LLC
- Main IPC: H01R24/00
- IPC: H01R24/00 ; A61N1/375 ; H01R13/514 ; H01R24/58 ; H01R24/86 ; H05K3/40 ; H01R13/52 ; H01R107/00

Abstract:
Implantable medical devices include headers having various features such as a modular design whereby the header is constructed from a series of stacked contact modules. Additional features include a feedthrough where pins exiting a housing of the implantable medical device extend into the header to make direct electrical connection to electrical contacts present within the header where those electrical contacts directly engage electrical connectors of leads inserted into the header. Other features include electrical contacts that are relatively thin conductors on the order of 0.040 inches or less and may include radial protrusions where the radial protrusions establish contact with the electrical connectors of the lead. Furthermore, electrical contacts may be mounted within the header in a floating manner so that radial movement of the electrical contact may occur during lead insertion.
Public/Granted literature
- US20140099833A1 IMPLANTABLE MEDICAL DEVICE HEADERS THAT FACILITATE DEVICE AND LEAD CONFIGURATION VARIANTS Public/Granted day:2014-04-10
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