Invention Grant
- Patent Title: Ultrasound probe
- Patent Title (中): 超声探头
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Application No.: US13768405Application Date: 2013-02-15
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Publication No.: US09173636B2Publication Date: 2015-11-03
- Inventor: Kei Irie
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, PC
- Priority: JP2011-256430 20111124
- Main IPC: A61B8/00
- IPC: A61B8/00 ; A61B8/12 ; A61B1/00

Abstract:
An ultrasound probe including: an ultrasound transmission/reception portion; a cable; a housing; a hole portion of the housing; an insulation pipe having a proximal end side exposed outside the housing; an insulation tube covering an outer circumference of an exposed region of the insulation pipe and an outer circumference of the cable; an adhesive located between the outer circumference of the exposed region and a distal end side region of the insulation tube and configured to adhere the insulation pipe and the insulation tube to each other; and a sticky member disposed between the exposed region and the distal end side region together with the adhesive.
Public/Granted literature
- US20130204140A1 ULTRASOUND PROBE Public/Granted day:2013-08-08
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