Invention Grant
- Patent Title: Interspinous implant
- Patent Title (中): 椎间植入物
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Application No.: US11746204Application Date: 2007-05-09
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Publication No.: US09173686B2Publication Date: 2015-11-03
- Inventor: Garrett A. Sheffer , Nathaniel E. Hawkins
- Applicant: Garrett A. Sheffer , Nathaniel E. Hawkins
- Applicant Address: US NJ Parsippany
- Assignee: EBI, LLC
- Current Assignee: EBI, LLC
- Current Assignee Address: US NJ Parsippany
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61B17/70 ; A61B19/00
Abstract:
An interspinous implant. The interspinous implant includes a resilient S-shaped body having first and second saddle-shaped portions. First and second stirrup-shaped brackets extend in opposite directions from the first and second saddle-shaped portions for engaging first and second spinous processes.
Public/Granted literature
- US20080281423A1 INTERSPINOUS IMPLANT Public/Granted day:2008-11-13
Information query
IPC分类:
