Invention Grant
- Patent Title: Microneedle array applicator and retainer
- Patent Title (中): 微针阵列涂抹器和保持架
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Application No.: US11718461Application Date: 2005-11-18
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Publication No.: US09174035B2Publication Date: 2015-11-03
- Inventor: Ted K. Ringsred , Franklyn L. Frederickson
- Applicant: Ted K. Ringsred , Franklyn L. Frederickson
- Applicant Address: US MN Saint Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN Saint Paul
- International Application: PCT/US2005/041870 WO 20051118
- International Announcement: WO2006/055802 WO 20060526
- Main IPC: A61M37/00
- IPC: A61M37/00 ; A61M25/02

Abstract:
An applicator that has an elastic band to snap a microneedle array against skin with a predetermined force and velocity. The microneedle array, which may be pre-loaded with drug(s), is attached to the elastic band such that the band can be secured in place (e.g., wrapped around a person's arm), pulled away from the arm, and released from a suitable distance so that the microneedle array snaps back against the arm with sufficient force to cause an intended amount of penetration of microneedles. Also, a microneedle application device has an elastic band, a microneedle device, and a structure attaching the band to the microneedle device.
Public/Granted literature
- US20080009825A1 Microneedle Array Applicator And Retainer Public/Granted day:2008-01-10
Information query
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