Invention Grant
- Patent Title: Method and apparatus for forging
- Patent Title (中): 锻造方法及装置
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Application No.: US11817779Application Date: 2005-06-20
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Publication No.: US09174268B2Publication Date: 2015-11-03
- Inventor: Ming Shyan John Yong , Kin Kong Tong , Meng Kwong Ho , Siew Fei Pook
- Applicant: Ming Shyan John Yong , Kin Kong Tong , Meng Kwong Ho , Siew Fei Pook
- Applicant Address: SG Singapore
- Assignee: Agency for Science, Technology and Research
- Current Assignee: Agency for Science, Technology and Research
- Current Assignee Address: SG Singapore
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- International Application: PCT/SG2005/000200 WO 20050620
- International Announcement: WO2006/093469 WO 20060908
- Main IPC: B21J9/02
- IPC: B21J9/02 ; B21J5/02 ; B22D18/02 ; B21J13/02

Abstract:
An apparatus for forming an article by forging. The apparatus has at least one die having a die cavity to receive material, said material being at least partially molten, and at least one punch to slidably engage the die cavity and to exert a forming pressure on material disposed in the cavity. There is also at least one pin for forming an article feature. The pin is to slidably engage the die and to contact the material, the pin being further to recede upon exertion of the forming pressure and to exert a feature forming pressure when receded and thereby form the article having the article feature when the material solidifies under the forming pressure.
Public/Granted literature
- US20110146364A1 METHOD AND APPARATUS FOR FORGING Public/Granted day:2011-06-23
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