Invention Grant
- Patent Title: Resistance welding a porous metal layer to a metal substrate
- Patent Title (中): 将多孔金属层电阻焊接到金属基底
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Application No.: US13300151Application Date: 2011-11-18
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Publication No.: US09174297B2Publication Date: 2015-11-03
- Inventor: Joseph R. Vargas , Steven Seelman , Clarence M. Panchison
- Applicant: Joseph R. Vargas , Steven Seelman , Clarence M. Panchison
- Applicant Address: US IN Warsaw
- Assignee: Zimmer, Inc.
- Current Assignee: Zimmer, Inc.
- Current Assignee Address: US IN Warsaw
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: B23K9/00
- IPC: B23K9/00 ; B23K11/18 ; A61F2/30 ; A61F2/36 ; B23K11/16

Abstract:
An apparatus and method are provided for manufacturing an orthopedic prosthesis by resistance welding a porous metal layer of the orthopedic prosthesis onto an underlying metal substrate of the orthopedic prosthesis. The resistance welding process involves directing an electrical current through the porous layer and the substrate, which dissipates as heat to cause softening and/or melting of the materials, especially along the interface between the porous layer and the substrate. The softened and/or melted materials undergo metallurgical bonding at points of contact between the porous layer and the substrate to fixedly secure the porous layer onto the substrate.
Public/Granted literature
- US20120125896A1 RESISTANCE WELDING A POROUS METAL LAYER TO A METAL SUBSTRATE Public/Granted day:2012-05-24
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