Invention Grant
- Patent Title: Liquid ejection head and method for manufacturing liquid ejection head
- Patent Title (中): 液体喷射头和液体喷射头的制造方法
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Application No.: US13956737Application Date: 2013-08-01
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Publication No.: US09174439B2Publication Date: 2015-11-03
- Inventor: Satoshi Ibe , Yoshinori Tagawa , Jun Yamamuro , Hiroto Komiyama , Kouji Hasegawa , Shiro Sujaku
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc. IP Division
- Priority: JP2012-173756 20120806
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14
Abstract:
A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.
Public/Granted literature
- US20140035999A1 LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD Public/Granted day:2014-02-06
Information query
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