Invention Grant
US09174445B1 Microfluidic die with a high ratio of heater area to nozzle exit area
有权
微流体模具具有高比例的加热器面积与喷嘴出口面积
- Patent Title: Microfluidic die with a high ratio of heater area to nozzle exit area
- Patent Title (中): 微流体模具具有高比例的加热器面积与喷嘴出口面积
-
Application No.: US14310633Application Date: 2014-06-20
-
Publication No.: US09174445B1Publication Date: 2015-11-03
- Inventor: Daniele Prati , Domenico Giusti , Simon Dodd
- Applicant: STMicroelectronics S.r.l. , STMicroelectronics, Inc.
- Applicant Address: IL Agrate Brianza US TX Coppell
- Assignee: STMicroelectronics S.r.l.,STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics S.r.l.,STMicroelectronics, Inc.
- Current Assignee Address: IL Agrate Brianza US TX Coppell
- Agency: Seed IP Law Group PLLC
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/16

Abstract:
The present disclosure is directed to a microfluidic die having a substrate with an inlet path that is configured to move fluid into the die. The die includes a plurality of heaters formed above the substrate, each heater having a first area, a plurality of chambers formed above the plurality of heaters, and a plurality of nozzles formed above the chambers. Each nozzle having an entrance adjacent to the chamber and an exit adjacent to en external environment, the entrance having a second area, and the second having a third area, the first area being greater than the second area, and the second area being greater than the third area. A ratio of the first area to the third area being greater than 5 to 1.
Information query
IPC分类: