Invention Grant
- Patent Title: Line deploying apparatus
- Patent Title (中): 线路部署装置
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Application No.: US13769996Application Date: 2013-02-19
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Publication No.: US09174712B2Publication Date: 2015-11-03
- Inventor: Manfred Klotz
- Applicant: Manfred Klotz
- Applicant Address: CA Bond Head, Ontario
- Assignee: Manfred Klotz
- Current Assignee: Manfred Klotz
- Current Assignee Address: CA Bond Head, Ontario
- Agency: Morris & Kamlay LLP
- Main IPC: B63C9/08
- IPC: B63C9/08 ; B63C9/20

Abstract:
An apparatus for deploying a line includes a disc having a generally V-shaped circumferential channel for retaining the line prior to deployment. The V-shaped channel guides a first wound turn of the line toward the central plane of the disc, and provides an enlarged space into which the turns of the line are unwound during deployment. The enlarged space prevents tangling of the line when the turns are unwound from the disc during deployment.
Public/Granted literature
- US20130244515A1 LINE DEPLOYING APPARATUS Public/Granted day:2013-09-19
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