Invention Grant
- Patent Title: Polymeric epoxy resin composition
- Patent Title (中): 聚合环氧树脂组合物
-
Application No.: US10548919Application Date: 2004-02-25
-
Publication No.: US09175145B2Publication Date: 2015-11-03
- Inventor: Christian Eger , Stephan Sprenger
- Applicant: Christian Eger , Stephan Sprenger
- Applicant Address: DE Geesthacht
- Assignee: EVONIK HANSE GMBH
- Current Assignee: EVONIK HANSE GMBH
- Current Assignee Address: DE Geesthacht
- Agency: Casimir Jones, S.C.
- Priority: EP03005538 20030311; EP03005377 20030312
- International Application: PCT/EP2004/001871 WO 20040225
- International Announcement: WO2004/081076 WO 20040923
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08J5/00 ; B82Y30/00 ; C08G59/18 ; C08G59/40 ; C08G59/58 ; H05K1/03 ; C08K3/36

Abstract:
The invention relates to a polymeric composition containing: a) at least one epoxy resin; b) at least one copolymer with groups, which react with epoxy resins, and with a glass transition temperature Tg of −20° C. or lower, c) nanoparticles having a mean particle size dmax ranging from 5 to 150 nm that is measured by means of a small-angle neutron scattering (SANS). The inventive composition enables the production of adhesives, composite materials, coatings and casting compounds exhibiting improved mechanical properties, particularly improve impact strength.
Public/Granted literature
- US20070191556A1 Polymeric epoxy resin composition Public/Granted day:2007-08-16
Information query