Invention Grant
- Patent Title: Sputter apparatus, control device for sputter apparatus and film formation method
- Patent Title (中): 溅射装置,溅射装置的控制装置和成膜方法
-
Application No.: US13721894Application Date: 2012-12-20
-
Publication No.: US09175379B2Publication Date: 2015-11-03
- Inventor: Yoshinori Nagamine , Hiroshi Tsunematsu
- Applicant: Canon Anelva Corporation
- Applicant Address: JP Kawasaki-shi
- Assignee: Canon Anelva Corporation
- Current Assignee: Canon Anelva Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2011-282095 20111222
- Main IPC: C23C14/00
- IPC: C23C14/00 ; C23C14/34 ; C23C14/35 ; C23C14/50 ; C23C14/54

Abstract:
In an embodiment of the present invention, the following operations are performed while a substrate holder is being rotated at a fixed rotation speed with plasma being generated. Specifically, a first state where a substrate holding surface of the substrate holder is exposed to a target holder is formed to start a first deposition of divisional depositions, and a second state where the surface is shut off from the target holder is formed in T/X seconds after the start of the first divisional deposition. Moreover, the first state is formed to start an n-th deposition of the divisional depositions when a reference point set on the substrate holder arrived at a position rotated by (n−1)×360/X degrees from a position of the reference point located at the start of the targeted deposition, and the second state is formed in T/X seconds after the start of the n-th divisional deposition.
Public/Granted literature
- US20130161182A1 SPUTTER APPARATUS, CONTROL DEVICE FOR SPUTTER APPARATUS AND FILM FORMATION METHOD Public/Granted day:2013-06-27
Information query
IPC分类: