A method of sputtering a component includes positioning a conductive substrate into a vacuum chamber, wherein the conductive substrate is tubular and has a surface. A source electrode including a source material may be inserted into the conductive substrate. A first bias voltage ΔVac1 may be applied between the conductive substrate and the vacuum chamber and a second bias voltage ΔVas1 may be applied between the source electrode and the vacuum chamber, sputtering the source material onto the conductive substrate.