Invention Grant
- Patent Title: Substrate holder and plating apparatus
- Patent Title (中): 基板支架和电镀装置
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Application No.: US13752460Application Date: 2013-01-29
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Publication No.: US09175416B2Publication Date: 2015-11-03
- Inventor: Jumpei Fujikata
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2012-016167 20120130
- Main IPC: C25D17/00
- IPC: C25D17/00 ; C25D17/06

Abstract:
There is provided a substrate holder which can absorb a change in the thickness between substrates and can hold a substrate while preventing deflection of the substrate and keeping the amount of compression of a substrate sealing member within a certain narrow range. The substrate holder includes a first holding member and a second holding member, both for detachably holding a substrate by holding a peripheral portion of the substrate therebetween; and a substrate sealing member, mounted to the second holding member, for sealing the peripheral portion of the substrate along a substrate sealing line. The first holding member has a thickness absorbing mechanism which biases the substrate toward the second holding member at positions along the substrate sealing line.
Public/Granted literature
- US20130192983A1 SUBSTRATE HOLDER AND PLATING APPARATUS Public/Granted day:2013-08-01
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