Invention Grant
- Patent Title: Providing coupler portions along a structure
- Patent Title (中): 沿着结构提供联接器部分
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Application No.: US13358569Application Date: 2012-01-26
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Publication No.: US09175560B2Publication Date: 2015-11-03
- Inventor: John Algeroy , Benoit Deville , Stephen Dyer , Dinesh Patel
- Applicant: John Algeroy , Benoit Deville , Stephen Dyer , Dinesh Patel
- Applicant Address: US TX Sugar Land
- Assignee: Schlumberger Technology Corporation
- Current Assignee: Schlumberger Technology Corporation
- Current Assignee Address: US TX Sugar Land
- Agent David J. Groesbeck
- Main IPC: E21B47/12
- IPC: E21B47/12 ; E21B17/02
Abstract:
A system or method includes providing coupler portions along a structure. The coupler portions are communicatively engageable with equipment in the structure.
Public/Granted literature
- US20130192851A1 PROVIDING COUPLER PORTIONS ALONG A STRUCTURE Public/Granted day:2013-08-01
Information query
