A modular pipe repair enclosure system includes first and second enclosure portions, and an enclosure attachment device. The first and second enclosure portions create an enclosure around the pipe for covering leaks. The enclosure has three openings for accommodating the pipe. The first and second openings are arranged at an angle of 180 degrees with respect to each other, and at an angle of 90 degrees with respect to the third opening, such that a straight line section of pipe may be accommodated by the first and second openings, an elbow section of pipe by the first and third openings, and a T-section of pipe by the first, second, and third openings. The system may further include a blank, for closing one of the openings, for use with a straight or elbow section, and a sleeve, for reducing the inner diameter of an opening, for accommodating pipes of different diameters.